Olympus BondMaster 600 MultiMode Bondtester

Olympus BondMaster 600 MultiMode Bondtester

The BondMaster 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamlined interface that features convenient presets for common applications. The enhanced user interface and simplified workflow of the BondMaster 600 offers archiving and reporting that are accessible to any level of user. The resolution and brightness of the 5.7-inch VGA screen on the BondMaster 600 handheld bond tester becomes even more apparent when switched into full-screen mode. Activated by the simple touch of a key, the full-screen mode is always accessible regardless of the display mode or inspection method you are using. The BondMaster 600 bond tester is programmed for a range of standard inspection methods, including pitch-catch RF, pitch-catch impulse, pitch-catch swept, resonance, as well as a notably improved mechanical impedance analysis (MIA) method. – Olympus IMS

Olympus BondMaster 600 MultiMode Bondtester

Portable, Lightweight, and Ergonomic
The ergonomic design of the BondMaster 600 is convenient for difficult-to-access inspection locations. For inspection in tight spaces, the factory-installed hand strap provides maximum comfort while maintaining access to the most critical functions.

Field Proven

The BondMaster 600’s case, based on a rugged, field-proven design, is world-renowned for withstanding the harshest, most demanding inspection conditions. The BondMaster 600 with its long battery life, airtight and water-resistant enclosure, high-friction bumpers, and dual-duty support stand/hook is a valuable tool for challenging inspection jobs.

Olympus BondMaster 600 MultiMode Bondtester

Key Features

Designed to meet the requirements of IP66.
Long battery life (up to 9 hours).
Compatible with existing BondMaster probes (PowerLink) and probes from other manufacturers.
Bright, 5.7-inch color VGA display.
Full-screen option in any display mode.
Intuitive interface with application-specific presets.
Instant display mode toggle using the RUN key.
New SCAN view (profile).
New SPECTRUM view and Frequency Tracking feature.
Direct-access key gain adjustment.
All-Settings configuration page screen.
Up to two real-time readings.
Storage capacity of up to 500 files (program and data).
On-board file preview.

Two Models for Flexibility and Compatibility

The BondMaster 600 is offered in two models to accommodate the varying needs of composite bond testing. The basic model includes all pitch-catch capabilities, while the B600M model features all bond testing inspection methods. The upgrade from basic to multimode can also be performed remotely.

Both BondMaster 600 models are compatible with existing Olympus BondMaster probes, including those equipped with the PowerLink technology. Optional adaptor cables are available to enable compatibility with probes from other manufacturers.

Application Recommended Method
General Honeycomb Composites Skin-to-Core Disbonds Pitch-Catch (RF or IMPULSE)
Honeycomb Composites Skin-to-Core Disbonds in Tapered Structures or Non-Constant Geometries Pitch-Catch (Swept)
Smaller Skin-to-Core Disbonds in Honeycomb Composite MIA
Identification or Repaired Areas in Honeycomb Composite MIA
General Detection of Delamination in Composite Resonance
Inspection of Metal-to-Metal Bonds Resonance

Feature B600 (basic) B600M (multimode)
Frozen-Signals Calibration √ √
Real-Time Readings √ √
Application Selection √ √
PowerLink Probe Support √ √
Pitch-Catch RF and Impulse Modes √ √
Pitch-Catch Swept √ √
Mechanical Impedance Analysis (MIA) Mode
√
Resonance Mode
√
(cable included)
Calibration Menu (Resonance and MIA Modes)
√

SPECS :

General Overall Dimensions (W × H × D) 236 mm × 167 mm × 70 mm (9.3 in. × 6.57 in. × 2.76 in.)
Weight 1.70 kg (3.75 lb), including lithium-ion battery
Standards or Directives Mil Standard 810G, CE, WEEE, FCC (USA), IC (Canada), RoHS (China), RCM (Australia and New Zealand), KCC (South Korea)
Power Requirements AC Mains: 100 VAC to 120 VAC, 200 VAC to 240 VAC, 50 Hz to 60 Hz
Inputs and Outputs One USB 2.0 peripheral port, one standard VGA analog output port, one 15-pin I/O port (male) with analog output, 3 alarm outputs.
Environmental Conditions Operating Temperature –10 °C to 50 °C (50 °F to 122 °F)
Storage Temperature 0 °C to +50 °C (32 °F to 122 °F) [with batteries] and -20 °C to +70 °C (-4 °F to 158 °F) [without batteries]
IP Rating Designed to meet requirements of IP66
Battery Battery Type Single lithium-ion rechargeable battery or AA size alkaline batteries (in an 8-cell holder).
Battery Life Between 8 to 9 hours
Display Size (W × H; Diagonally) 117.4 mm × 88.7 mm; 146.3 mm (4.62 in. × 3.49 in.; 5.76 in.)
Type Full VGA (640 × 480 pixels) color, transflective LCD (liquid crystal display).
Modes Normal or Full screen, 8 color schemes. RUN key to toggle between screen modes.
Grids and Display Tools Choice of 5 grids, crosshairs (X-Y views only)
Connectivity and Memory PC Software BondMaster PC software, included in base BondMaster 600 kit. BondMaster PC allows viewing saved files and printing reports.
Data Storage 500 files featuring user-selectable on-board preview.
Languages English, Spanish, French, German, Italian, Japanese, Chinese, Russian, Portuguese, Polish, Dutch, Czech, Hungarian, Swedish, and Norwegian.
Applications Application Selection menu for easy and rapid configuration in all modes.
Real-Time Readings Choice of up to 2 real-time readings measuring signal characteristics (list depends on selected mode)
Probes Types Supported Probe Types Pitch-Catch, Mechanical Impedance Analysis (MIA-B600M only) and Resonance probes (B600M only). The instrument is fully compatible with BondMaster PowerLink and non-PowerLink probes, as well as those of other main probe and accessory suppliers.
Bond Testing Specifications (All BondMaster Models) Probe Connectors 11-pin Fischer
Gain* 0 dB to 100 dB in 0.1 or 1 dB increments
Rotation* 0° to 359.9° in 0.1° or 1° increments
Scan View* Variable from 0.520 s to 40 s
Low Pass Filter* 6 Hz to 300 Hz
Probe Drive LOW, MEDIUM, and HIGH user-adjustable settings
Variable Persistence* 0.1 s to 10 s
Variable Display Erase* 0.1 s to 60 s
Available Alarm Types* 3 simultaneous alarms. Choices include BOX (rectangle), POLAR (circle), SECTOR (pie), SCAN (time-based), and SPECTRUM (frequency response).
Reference Dots* Up to 25 user-defined dot recordings
Pitch-Catch Specifications (All B600 Models) Supported pitch-catch modes User-selectable mode. Choice of RF (toneburst), Impulse (envelope) or Swept (frequency sweep)
Frequency Range 1 kHz to 50 kHz (RF, Impulse) or 1 kHz to 100 kHz (Swept)
Gain 0 dB to 70 dB in 0.1 or 1 dB increments
Gate 10 μs to 7920 μs, adjustable in 10 μs steps. New Auto Gate mode automatically detects maximum amplitude.
Frequency Tracking* Up to 2 user-adjustable markers to monitor 2 specific frequencies from the Swept figure.
Mechanical Impedance Analysis (MIA) Specifications (B600M Only) Calibration Wizard Calibration menu to determine best frequency for application, based on simple “BAD PART” and “GOOD PART” measurements
Frequency Range 2 kHz to 50 kHz
Calibration Wizard Calibration menu to determine best frequency based on the probe response